Product Packaging

DALSA Semiconductor delivers products under a variety of different forms. Almost any combinations are possible.

• Wafer form
  • Standard or Special Thickness
  • Standard or Bumped Pads
• Probed die
  • Wafer on Film or Tray Pack
• Packaged devices
  • All available Ceramic or Plastic Packages
  • Tape & Reel (For PLCC & SOIC Package Type)

More information

• Device storage, shelf life, and soldering

For more information, contact Sales.

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