An Exceptional Foundry for Your Exceptional Designs

Foundry Facilities and Capabilities

Exceptional capabilities, elite equipment...and the expertise to exploit it

Motorola's Foundry of the Year Award in 2001, as well as Gold Performance Awards in 2000 and 2001

Contents:
  Overview
  Capacity
  Clean Rooms
  Quality

Overview

As a dedicated semiconductor manufacturing foundry our goal is to deliver innovative foundry capabilities as a manufacturing partner to fabless and fab-lite semiconductor companies.

Our fabrication strengths include integration of sense and actuation circuitry alongside MEMS structures, flexible wafer-scale packaging, and a range of materials, equipment, and process flows that enable the most advanced MEMS and image sensor performance. Many of our process technologies are usually considered unconventional or even contradictory in mainstream integrated circuit production, but DALSA Semiconductor's foundry services together provide designers and customers with a rare ability to optimize architecture, performance, and reliability to meet the needs of high-volume, mission-critical microsystems in photonics, telecom, biomedical, automotive, and industrial applications.

Beyond fabrication, DALSA Semiconductor offers the tighter coupling of front-end fabrication with back-end packaging processes required for high-performance MEMS. Since by their nature MEMS devices require interaction with their environments beyond electrical signals, the testing, assembly and packaging appropriate for more mainstream ICs are often insufficient to ensure reliable performance. DALSA Semiconductor has the equipment and process expertise to protect and preserve device performance through the crucial finishing operations.

DALSA Semiconductor's established quality system and management depth have helped us continually satisfy our customers and remain profitable through difficult global economic conditions. We are a reliable high-volume manufacturing partner providing a toolkit of wafer fabrication process technologies engineered to be highly flexible. Our rare combination of capabilities, including innovative sense and actuation circuit integration, comprehension packaging, volume production, and reliability allow us to help you succeed with advanced, highly-differentiated, and cost-effective designs.

Bromont received Motorola's Foundry of the Year Award in 2001, as well as Gold Performance Awards in 2000 and 2001.

In 2004, DALSA Semiconductor won several prestigious Canadian and Provincial awards:
November 2004 "Development of Export Sales Award" from Canadian Manufacturers & Exporters’
June 2004 "Enterprise of the Year" Award from Federation of Quebec Chambers of Commerce
June 2004 "Contribution to Economic Development" Award from Federation of Quebec Chambers of Commerce
January 2004 DALSA Semiconductor received significant international media coverage for its participation as a subcontractor to JPL for the semiconductor manufacture of the CCD image sensors used on NASA Mars Rovers.

Capacity

150mm Fab
CMOS from 0.8 µm to 4 µm
CCD 0.5 µm and 2.5 µm
Capacity: 15000 Wafers/Month

Clean Rooms

We use three clean room areas:

Expertise

Quality

MEMS Technologies

Read more about our MEMS capabilities in our MEMS section.

CMOS and High-Voltage CMOS Technologies

Read more about our analog & mixed-signal processes in our CMOS section and High-Voltage CMOS section.

CCD Technolgies

DALSA Semiconductor is one of the few open CCD image sensor foundries in the world. Read more about our CCD processes in our CCD section.

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